
High Speed Surface mount (SMT)
Through-hole (PTH)
Designated Prototype SMT line
AOI
Rigid, Flex, FR-4, metal and hybrid
Single or double-sided, multiple layers
Single board or panelization
RoHS-compliant and tin-lead options
Sunburst Electronics is a full-service provider of custom Electronic Manufacturing Services including Medical, Aerospace, Transportation, Industrial Controls, Oil and Gas. We offer Printed Circuit Board Assembly, full box builds and full service fulfillment services
We provide complete or partial product assembly, product design, testing, and full lifecycle supply chain management.
High Speed Surface mount (SMT)
Through-hole (PTH)
Designated Prototype SMT line
AOI
Rigid, Flex, FR-4, metal and hybrid
Single or double-sided, multiple layers
Single board or panelization
RoHS-compliant and tin-lead options
BGA and micro BGA
Prototype through full production
Conformal coatings, potting
Wave Solder, selective solder, hand solder
DI water and no-clean
Full turnkey assemblies
Labor only, customer consigned components
Enclosure assembly
Chassis assembly
Electro-mechanical assembly
Environmental stress screening
-Burn-in
-Vibration
-Software loading
Mechanical revisions/configurations
Specialized Builds:
-Explosion Proof Assemblies
-Medical Device Assemblies
-Large Cabinets and Control Panel Assemblies
-Highly Complex Data Servers
-Power Supply-VITA Compliant
Ruggedized box builds engineered to MIL-STD-810 and MIL-STD-461 standards, with VITA-compliant integration for mission-critical military and aerospace applications
Custom Cable Assemblies and wire harnesses, including power, coaxial, fiber-optic cables and other
Precision wire prep and termination, including automated wire cutting, stripping, crimping of terminals, plug housing assembly, and heat-shrink applications
Built to IPC/WHMA-A-620 standards for cable and wire harness assemblies
Labeling, braiding, overmolding, and EMI shielding
Comprehensive testing capabilities: Hi‑Pot, continuity, insulation resistance, pull/insertion/rotation/extraction, salt‑spray, vibration, bending
Industry-spanning expertise across aerospace (aircraft, satellites), medical, automotive, telecom, industrial, and ag-tech sectors—delivering tailored harness solutions
Lifecycle management
Circuit board schematic and layout engineering
Input of board design optimization
Box-build for turnkey solutions
Hardware, software and firmware engineering
Development of functional test and fixtures
New product introduction
LabView software test systems
Functional testing
Vibration testing
Environmental stress screening
Programming
Customized burn-in cycling
In-circuit testing
Production-test planning
Functional test development
Design for Manufacturibility
Our potting services provide rugged protection for your assemblies in extreme environments:
Moisture, chemical, and dust resistance
Mechanical reinforcement against vibration and shock
Electrical insulation and thermal management
We offer precision conformal coating solutions to extend the durability and reliability of your electronics:
Acrylic, silicone, urethane, and parylene coatings
Spray, dip, brush, and selective coating methods
High-dielectric strength and environmental resistance
Precise masking to protect critical components
IPC-CC-830 compliance
Our testing capabilities ensure that every product meets the highest performance and reliability standards:
Functional testing of assembled systems
Vibration and burn-in testing for early failure detection
Environmental Stress Screening (ESS)
In-circuit testing with flying probe systems*
LabVIEW-driven automated test systems
Programming and production-level test planning
We specialize in high-precision BGA and micro-BGA assembly, ensuring reliable performance for complex, densely packed PCBs used in mission-critical systems. Our capabilities include:
Automated BGA and micro-BGA placement and reflow using high-accuracy equipment
X-ray inspection and rework systems to verify hidden solder joints and ensure long-term reliability
Precision rework stations equipped with split-vision alignment and controlled reflow profiles
Our X-ray inspection capabilities provide detailed, non-destructive insight into the internal structure of complex PCB assemblies, ensuring quality and reliability where traditional visual inspection cannot reach.Highlights:
-High-resolution imaging to visualize hidden solder joints, vias, and internal layers
-Defect detection for BGA, micro-BGA, and CSP packages, including voids, bridging, cracks, and misalignment
-Real-time image capture and analysis for fast root cause identification of soldering defects
-Advanced analysis software for precise void measurement, documentation, and trend reporting
-Essential for HDI, multilayer, and densely populated boards where conventional inspection falls short
-Trusted in aerospace, medical, and defense electronics where solder joint integrity is critical