
High Speed Surface mount (SMT)
Through-hole (PTH)
Designated Prototype SMT line
AOI
Rigid, Flex, FR-4, metal and hybrid
Single or double-sided, multiple layers
Single board or panelization
RoHS-compliant and tin-lead options
Sunburst Electronics is a full-service provider of custom Electronic Manufacturing Services, proudly serving industries such as Medical, Defense, Aerospace, Transportation, Industrial Controls, and Oil & Gas. We specialize in Printed Circuit Board Assembly (PCBA), Box Builds and Cable Assembly services.
We provide complete or partial product assembly, product design, testing, and full lifecycle supply chain management. With a commitment to precision, quality and customer satisfaction, Sunburst Electronics is your trusted partner for end-to-end manufacturing excellence.
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High Speed Surface mount (SMT)
Through-hole (PTH)
Designated Prototype SMT line
AOI
Rigid, Flex, FR-4, metal and hybrid
Single or double-sided, multiple layers
Single board or panelization
RoHS-compliant and tin-lead options

BGA and micro BGA
Prototype through full production
Conformal coatings, potting
Wave Solder, selective solder, hand solder
DI water and no-clean
Full turnkey assemblies
Labor only, customer consigned components

Enclosure assembly
Chassis assembly
Electro-mechanical assembly
Environmental stress screening
-Burn-in
-Vibration
-Software loading
Mechanical revisions/configurations
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Specialized Builds:
-Explosion Proof Assemblies
-Medical Device Assemblies
-Large Cabinets and Control Panel
Assemblies
-Highly Complex Data Servers
Ruggedized box builds engineered to MIL-STD-810 and MIL-STD-461 standards, for mission-critical military and aerospace applications

Custom Cable Assemblies and wire harnesses, including power, coaxial, fiber-optic cables and other
Precision wire prep and termination, including automated wire cutting, stripping, crimping of terminals, plug housing assembly, and heat-shrink applications
Built to IPC/WHMA-A-620 standards for cable and wire harness assemblies

Labeling, braiding, overmolding, and EMI shielding
Comprehensive testing capabilities: Hi‑Pot, continuity, insulation resistance, pull/insertion/rotation/extraction, salt‑spray, vibration, bending
Industry-spanning expertise across aerospace (aircraft, satellites), medical, automotive, telecom, industrial, and ag-tech sectors—delivering tailored harness solutions

Lifecycle management
Circuit board schematic and layout engineering
Input of board design optimization
Box-build for turnkey solutions
Hardware, software and firmware engineering
Development of functional test and fixtures
New product introduction
LabView software test systems
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Functional testing
Vibration testing
Environmental stress screening
Programming
Customized burn-in cycling
In-circuit testing
Production-test planning
Functional test development
Design for Manufacturibility

Our potting services provide rugged protection for your assemblies in extreme environments:
Moisture, chemical, and dust resistance
Mechanical reinforcement against vibration and shock
Electrical insulation and thermal management

We offer precision conformal coating solutions to extend the durability and reliability of your electronics:
Acrylic, silicone, urethane, and parylene coatings
Spray, dip, brush, and selective coating methods
High-dielectric strength and environmental resistance
Precise masking to protect critical components
IPC-CC-830 compliance

Our testing capabilities ensure that every product meets the highest performance and reliability standards:
Functional testing of assembled systems
Vibration and burn-in testing for early failure detection
Environmental Stress Screening (ESS)
In-circuit testing with flying probe systems*
LabVIEW-driven automated test systems
Programming and production-level test planning

We specialize in high-precision BGA and micro-BGA assembly, ensuring reliable performance for complex, densely packed PCBs used in mission-critical systems. Our capabilities include:
Automated BGA and micro-BGA placement and reflow using high-accuracy equipment
X-ray inspection and rework systems to verify hidden solder joints and ensure long-term reliability
Precision rework stations equipped with split-vision alignment and controlled reflow profiles

Our X-ray inspection capabilities provide detailed, non-destructive insight into the internal structure of complex PCB assemblies, ensuring quality and reliability where traditional visual inspection cannot reach.Highlights:
-High-resolution imaging to visualize hidden solder joints, vias, and internal layers
-Defect detection for BGA, micro-BGA, and CSP packages, including voids, bridging, cracks, and misalignment
-Real-time image capture and analysis for fast root cause identification of soldering defects
-Advanced analysis software for precise void measurement, documentation, and trend reporting
-Essential for HDI, multilayer, and densely populated boards where conventional inspection falls short
-Trusted in aerospace, medical, and defense electronics where solder joint integrity is critical


